lhir4843/a-pf doc. no : qw0905- rev. : date : - 2016 a 11-apr. data sheet lhir4843/a-pf infrared emitting diodes ligitek electronics co.,ltd. property of ligitek only pb lead-free parts l dcc
t-1 3/4 package individually part no. infrared emitting diodes encapsulated in water clear plastic thelhir4843/a-pf series are high power solution grown efficiency gallium arsenide descriptions: 3. low average degradation. 2. suitable for pulsed applications. 1. high radiant intensity. features: device selection guide: note : 1.all dimension are in millimeter tolerance is lhir4843/a-pf ligitek electronics co.,ltd. property of ligitek only page1/8 1.0 3.8
note : 1.the forward voltage data did not including ? v v 1 50 ratings hir a ma unit page2/8 lhir4843/a-pf part no. 110
8 a5 6 ligitek electronics co.,ltd. property of ligitek only lhir4843/a-pf brightness code for standard led lamps group hir chip bin code part no. radiant intensity(mw/sr)at 20 ma min. max. page3/8 a4 5 6 a2 3 4 5 4 a3 a1 0 3
fig.3 relative radiant power vs. forward dc current fig.5 forward dc voltage vs. temperature i fdc [ma] f o r w a r d d c v o l t a g e n o r m a l i z e @ 2 0 m a , 2 5 [ ] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a fig.4 relative radiant power i fpk [ma] r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 1 0 0 m a typical electro-optical characteristics curve forward voltage[v] fig.1 forward current vs. rorward voltage f o r w a r d c u r r e n t [ m a ] wavelength[nm] fig.2 relative radiant power vs. wavelength r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only hir chip 0.01.02.03.04.0 0.1 1 10 100 1000 10 0.1 1 0.1 -40 0.8 -40 0.0 r e l a t i v e r a d i a n t p o w e r n o r m a l i z e @ 2 0 m a , 2 5
cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. storage time: 1.the operation of temperatures and rh are : 5 ?
2. the led lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45
ligitek electronics co.,ltd. property of ligitek only preheat 60 seconds max 0 0 25 120 50 2 260 100 150 time(sec) 260
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=245
packing specification 1.1000 pcs / bag w 3. 12 inner boxes / carton size : l x w x h 58.5cm x 34cm x 34cm 2. 8 bag / inner box size : l x w x h 33.5cm x 19cm x 7.5cm w h c/no: made in china i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s l l h
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